ECO-CORE DATACENTER SUSTAINABLE | LIQUID COOLED REMOTE RESEARCH ADVANCED SCIENCE All Photonics Network DATA TRANSMISSION
OPEN INFRASTRUCTURE · COMPUTEX 2026

Edgecore Open Fabric Built for IOWN®

The foundation of the All-Photonics Network. Composable compute and open networking unified for deterministic, ultra-low-latency AI infrastructure.

OPTICAL SPEED
5 μs / km
OWS SCALE
32× 800G per fiber / Intra DC 102.4 Tbps
PROTOCOL
Open APN / ROADM
STANDARD
Open Compute / IOWN
01

Open Networking

APN-integrated switching and transport from leaf to DCI.

DWDM λ SPECTRUM
7 ACTIVE λ
END-TO-END LATENCY
160 ns
ZERO O-E-O
OPTICAL TRANSPORT
IOWN DCI Gateway
IRX3032 OWS + AMX3200 Trans/Muxponder
SIGNAL PATH
Transponder APN-T
OWS APN-G · No O-E-O
Muxponder APN-T

IRX3032 — LCoS-based optical switch, 32 WDM channels, 160ns latency, 25.6T optical bandwidth. No O-E-O conversion.

EXPLORE
ASIC 102.4T
SPINE FABRIC
Spine Node
AIS1600-64O / AIS800-64O

World's fastest AI switches powered by Broadcom Tomahawk® 6 & 5. Ultra-deep shared buffer with DLB/GLB for zero-packet-drop LLM training at scale.

1.6T Throughput102.4 Tbps
800G Throughput51.2 Tbps
EXPLORE
64x 400G QSFP56-DD · 25.6T
LEAF ACCESS
Leaf Node
DCS520 · 25.6T · 64× 400G

25.6T ToR switching powered by Broadcom Tomahawk 4. 64× 400G QSFP56-DD ports with ONIE for open NOS deployment including SONiC.

Ports64× 400G QSFP56-DD
Throughput25.6 Tbps
EXPLORE
02

Composable Compute

Disaggregated accelerator chassis and memory fabric for AI workloads.

92% 78% 100% 65% 88% 45% 99% 72% 84% 58% 256 GB/s PER SLOT
COMPOSABLE COMPUTE
PCIe Chassis
Accelerator Expansion Fabric

PCIe Gen 5/6-ready chassis for composable GPU/ASIC attachment with hot-swap and OOB management.

PCIe Gen5.0 / 6.0 Ready
BW / Slot256 GB/s
EXPLORE
HOST 1 HOST 2 HOST 3 HOST 4 SHARED POOL 20TB · CXL 3.1
MEMORY FABRIC
CXL Chassis
Disaggregated Memory Pooling

CXL 3.1-native memory pooling. 4 hosts + 2 CEC, with 20 CXL cards total supporting up to 20 TB shared memory pool.

ProtocolCXL 3.1
Shared MemUp to 20 TB
EXPLORE
03

Rack Infrastructure

Liquid cooling integration for high-density AI pod deployment.

THERMAL INFRASTRUCTURE
Liquid Cooling CDU
High-Density Heat Exchange

100–200 kW in-rack CDU with N+1 redundancy, real-time flow telemetry, BMS/SDN integration. Up to 20% PUE gain.

Capacity100–200 kW
RedundancyN+1 Pump
MonitoringFlow + Leak
PUE GainUp to −20%
LIQUID COOLING STATUS
SYSTEM ACTIVE
All zones cooling · flow nominal
COOLANT TEMP
18.0°C
FLOW RATE
0 L/m
VIEW DETAILS
SERVER ROW 01 02 IN-RACK CDU CDU 03 04 IN-ROW CDU IN ROW CDU IR 05 06 07 08 ··· N HOT RETURN COLD SUPPLY Chiller N+1 Redundant −20% PUE 200 kW 0 L/min Scales up to 10 racks per row · supports in-rack and in-row deployments
COOLANT
18.0°C
FLOW
0 L/m
PUE GAIN
−20%
STATUS
ACTIVE